Project cooperation
Scalable CPO for 1D/2D optical interconnects
Supporting advanced CPO/NPO approach on Si interposer with wafer-level optical packaging for low-loss 1D/2D optical interconnects
- early
- HORIZON-CL4-2027-05-DIGITAL-EMERGING-03: Advanced integrated photonic devices for extended features and ultra-low power consumption (RIA) (Photonics Partnership)
Author
CTO & cofounder at ICON Photonics
Champs-sur-Marne, France