Industrial laser micro-processing

Our R&D is focused on :

• developments of advanced optical systems for upscaling capabilities of our machines

• developments of advanced processes (TGVs, TSVs, Through Diamonds Vias)

• High accuracy down to 2µm

• Typical tool size between few microns up to few hundreds of microns

• We can address any kind of materials: metals, glass, Si, SiC, WC, polymers, and even diamond, etc ...

Here is a non-exhaustive list of our developments:

• TGVs, TDVs for vertical interconnexions and heat dumps of semicon and power electornics or antennas components

• Microfluidics in glass and polymers for cooling Chips and/or for medtech

• Welding and/or bonding of dissimilar materials: aluminum on glass (R&D), metals on polymers (proven), silicon on diamond (R&D), glass on glass (proven), glass on silicon (proven)

• Fast Laser C-UAS

• Heat exchangers

• 6G Phased array antennas

• etc ...

We also offer Jobshop capabilities to unrisk your research or small production