Enterprise Europe Network

Meet the Dutch at Semicon India 2026

17 – 19 Sept 2026 | New Delhi, India

James Tan

Regional Sales Manager

Boschman

Singapore, Singapore

15 profile visitsDutch participant- Netherlands Pavilion

Assigned meeting point:Boschman #2 - Dutch pavilion

My organisation

Boschman

Boschman

Company (SME)

Duiven, Netherlands

Boschman Technologies is a market leader in Pressure Sintering and Advanced Transfer Molding, offering both development services and industrial equipment. We provide a one-stop-shop for innovative packaging solutions, from concept to industrialization, ensuring efficient and effective packaging with a short time-to-market. Boschman specializes in advanced transfer molding and sintering systems for electronic assembly industries, offering technologies like Ag-Sintering, Film Assisted Molding (FAM), Dynamic Insert Technology (DIT), and Through Polymer Via (TPV). Their applications span various industries, including automotive, medical, avionics, mobile, industrial, and renewables. Their package development process includes conceptualization, design, prototyping, and sampling, ensuring high yield production and compliance with ISO-9001-2015 standards. Boschman also offers low to medium volume assembly services, leveraging over 30 years of experience in advanced packaging solutions.
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About me

Type of companies/contacts that are interested to meet

 Semiconductor advanced packaging related

Additional information

Why it would be interesting for organizations to speak with you

  • Boschman is a high-tech, solution driven Dutch company focusing on advanced packaging solutions

  • Boschman is the one stop shop for highly innovative packaging solutions

  • Boschman specializes in the development and supply of advanced transfer molding and sintering systems for electronic assembly industries across the globe

  • Boschman offer added-value encapsulation and bonding process and equipment solutions for a wide range of packages.

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