Boschman, one-stop solution provider, from idea to industrialization, for Semiconductor advanced packaging activities.

The global energy transition is driving much higher electrification levels, affecting the entire energy system from Generation to Transmission to Consumption.

One of the critical building blocks for the “electric revolution” are power modules to make the entire electric eco-system more efficient, reliable, cost effective and smarter. Currently, automotive is pioneering these technologies with the advent of electric vehicles, but it is expected that these technologies will see quick and widespread adoption throughout other sectors in the energy system.

For these high-power applications, the industry is moving to next generation semiconductor materials, so called Wide-bandgap materials (WBG) to replace Silicon (Si) such as Silicon Carbide (SiC) and Gallium Nitride (GaN).

Boschman has pioneered Sintering & Epoxy Molding processes with early adopters in the industry and has positioned itself as the market leader for both Pressure Sintering and Advanced Transfer Molding system for wide range of power module packages and E-motor application.