EU-Japan Semicon Matching

16 – 19 Dec 2025 | Tokyo, Japan

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PartnershipUpdated on 16 November 2025

Foundries and tool services for 300 mm wafer processing

CEO at Chipmetrics

Joensuu, Finland

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For example partners having access and willingness to offer services in 300 mm wafer scale in dry etching, die to wafer bonding, wafer-to-wafer bonding, thin film processes or CMP.

Organisation

Chipmetrics

EU Business Hub ー 中小企業・スタートアップ / SME/startup

Joensuu, Finland

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