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16–19 Dec 2025 | Tokyo, Japan

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PartnershipUpdated on 16 November 2025

Foundries and tool services for 300 mm wafer processing

CEO at Chipmetrics

Joensuu, Finland

About

For example partners having access and willingness to offer services in 300 mm wafer scale in dry etching, die to wafer bonding, wafer-to-wafer bonding, thin film processes or CMP.

Organisation

Chipmetrics

EU Business Hub ー 中小企業・スタートアップ / SME/startup

Joensuu, Finland

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