PartnershipUpdated on 16 November 2025
Foundries and tool services for 300 mm wafer processing
CEO at Chipmetrics
Joensuu, Finland
About
For example partners having access and willingness to offer services in 300 mm wafer scale in dry etching, die to wafer bonding, wafer-to-wafer bonding, thin film processes or CMP.
Organisation
Similar opportunities
Product
- Other / その他
- Other / その他
- Healthcare / ヘルスケア
- Energy Sector / エネルギー分野
- Manufacturing partner / 製造事業パートナー
- Industrial Applications / 産業用アプリケーション
- Distribution partner / ディストリビューションパートナー
- Research & Development partner / 研究開発パートナー
Xavier Torres-Tuset
Chief Sales & Marketing Officer at Obducat
Lund, Sweden
Product
Semiconductor packaging equipment for SSAIL technology.
Tadas Kildusis
Chief Commercial Officer at Akoneer
Vilnius, Lithuania