MCT200/MCT300 WET

Overview:
The MCT 200/300 WET is a fully-automated micro-cluster track tool designed for wet etching, lift-off and cleaning processes. It is built for high-volume manufacturing (HVM) environments, offering high reliability, uptime and configurable modules.

Key Features:

• Supports substrate sizes from 2″ to 12″ Ø, or 2″×2″ to 9″×9″ square.

• Modular design: standard I/O station, linear-track robot, and up to 10 modules for etching, lift-off, cleaning or thermal processing.

• Thermal processing option with hot plates up to ~300 °C (and optionally up to ~450 °C) and HMDS vapor prime capability.

• Advanced wet process support: piranha clean, SC-1/SC-2 cleans, solvent sprayer/puddle, HF/metal etch, high-pressure DI rinse, megasonic options.

• Backside protection features: chucks with low contact, Bernoulli or Venturi solutions to protect the substrate during aggressive wet processing.

• Industry‐ready connectivity: batch & process tracking, unlimited recipe storage, Ethernet, MES interface support (SECS/GEM, OPC/UA).

Applications:
Ideal for sectors such as LEDs & displays, SiC components, 5G modules, MEMS, opto-electronic & photonic devices and advanced packaging — wherever precision wet process handling is required.

Why it matters:
The MCT 200/300 WET gives manufacturers the flexibility and throughput to handle demanding wet process flows at scale—bridging the gap between lab tools and full production lanes with strong process control, scalability and adaptability.