MC 204 WET

Overview
The MC 204 WET is a fully-automatic micro-cluster tool designed for wet etching, lift-off, and cleaning in research & development (R&D) and low-volume manufacturing (LVM) environments. It supports substrates from 2″ to 8″ Ø or 2″ × 2″ to 6″ × 6″ square.

Key Features

• Modular configuration: the standard unit comes with an I/O station plus three modules which can be dedicated individually to etching, lift-off, cleaning or thermal processing.

• Thermal processing option supports up to 8 temperature plates (hot, cool and HMDS vapor prime) with hot plate temperature range up to ~300 °C (with options up to ~450 °C).

• Supports a broad range of process options: piranha clean, SC1/SC2 clean, solvent clean, HF etch/metal-Si etch, megasonic, high-pressure DI-water rinse etc.

• Multiple chuck/wafer handling solutions: low contact chucks, Bernoulli or venturi chucks for backside protection, support for square substrates.

• Designed for connectivity: recipe storage, batch & process tracking, Ethernet interface, options for MES integration (SECS/GEM, OPC/UA) etc.

**Applications
**The MC 204 WET is well suited for use in industries such as:

• LED and display manufacturing

• SiC components and 5G modules

• ICs, MEMS, opto-electronic and photonic devices

• Advanced packaging and other high-precision wet-process needs