About
Electrical characterisation,package analysis (Scanning acoustic microscopy, SAM, X-ray analysis), die exposure/decapsulation, failure site localisation with thermal techniques (liquid crystal) or photo emisssion microscopy, probing technology, deprocessing, x-section analysis, inspection technologies (e.g. Scanning electron microspcopy with EDX, SIMS, AES)
Similar opportunities
Service
Electronic Components & Systems: Non-destructive Testing
Manfred Mücke
Key Researcher Embedded Computing at Materials Center Leoben Forschung GmbH
Leoben, Austria
Product
Super Hi res 0.16 µm X-ray Inspection System
- Microtechnology
NICK INOUE
General Manager at Techno Horizon Co.,LTD.
Eindhoven, Netherlands
Service
Electronic Components & Systems: Destructive Testing
Manfred Mücke
Key Researcher Embedded Computing at Materials Center Leoben Forschung GmbH
Leoben, Austria