SILICON ALPS Cluster

EBSCON 2025

8 Oct 2025 | Graz, Austria

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ServiceUpdated on 15 September 2025

Electronic Components & Systems: Destructive Testing

Manfred Mücke

Key Researcher Embedded Computing at Materials Center Leoben Forschung GmbH

Leoben, Austria

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  • Determination of physical properties via DMA

  • Determination of mechanical properties via shear, pull, push and peel tests as well as 3- and 4-point bending tests

  • Determination of thermal and chemical properties via DSC (reaction kinetics, specific heat capacity, melting temperature, glass transition temperature)

  • Thermal impedance measurements for the determination of thermal properties (e.g. heat flow)

  • Electrical characterisation of components via tip point station (sources AC/DC up to 1000 V)

  • Light microscopy of electrical components

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