ServiceUpdated on 15 September 2025
Electronic Components & Systems: Destructive Testing
Key Researcher Embedded Computing at Materials Center Leoben Forschung GmbH
Leoben, Austria
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Determination of physical properties via DMA
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Determination of mechanical properties via shear, pull, push and peel tests as well as 3- and 4-point bending tests
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Determination of thermal and chemical properties via DSC (reaction kinetics, specific heat capacity, melting temperature, glass transition temperature)
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Thermal impedance measurements for the determination of thermal properties (e.g. heat flow)
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Electrical characterisation of components via tip point station (sources AC/DC up to 1000 V)
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Light microscopy of electrical components
Attached files
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