ServiceUpdated on 15 September 2025
Electronic Components & Systems: Non-destructive Testing
Key Researcher Embedded Computing at Materials Center Leoben Forschung GmbH
Leoben, Austria
About
-
3D computed tomography (failure analysis, investigations of components and materials, quantitative analyses such as porosity and inclusion analyses or nominal-actual value comparisons) and 2D radioscopy
-
Scanning acoustic microscopy (e.g. for investigation of delamination)
-
In-situ failure mode analysis of the thermal behaviour of electronic components
-
Live mode in-situ thermal testing of electronic components
Attached files
Similar opportunities
Service
Electronic Components & Systems: Destructive Testing
Manfred Mücke
Key Researcher Embedded Computing at Materials Center Leoben Forschung GmbH
Leoben, Austria
Service
Julien Magnien
Group Leader Services - Microelectronics at Materials Center Leoben Forschung GmbH
Leoben, Austria