SILICON ALPS Cluster

EBSCON 2025

8 Oct 2025 | Graz, Austria

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ServiceUpdated on 15 September 2025

Electronic Components & Systems: Non-destructive Testing

Manfred Mücke

Key Researcher Embedded Computing at Materials Center Leoben Forschung GmbH

Leoben, Austria

About

  • 3D computed tomography (failure analysis, investigations of components and materials, quantitative analyses such as porosity and inclusion analyses or nominal-actual value comparisons) and 2D radioscopy

  • Scanning acoustic microscopy (e.g. for investigation of delamination)

  • In-situ failure mode analysis of the thermal behaviour of electronic components

  • Live mode in-situ thermal testing of electronic components

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