ServiceUpdated on 15 September 2025
Electronic Components & Systems: Non-destructive Testing
Key Researcher Embedded Computing at Materials Center Leoben Forschung GmbH
Leoben, Austria
About
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3D computed tomography (failure analysis, investigations of components and materials, quantitative analyses such as porosity and inclusion analyses or nominal-actual value comparisons) and 2D radioscopy
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Scanning acoustic microscopy (e.g. for investigation of delamination)
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In-situ failure mode analysis of the thermal behaviour of electronic components
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Live mode in-situ thermal testing of electronic components
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Electronic Components & Systems: Destructive Testing
Manfred Mücke
Key Researcher Embedded Computing at Materials Center Leoben Forschung GmbH
Leoben, Austria
Project cooperation
- Early
- Research
- Technical
Roman Armgarth
COO & CTO at DP Patterning
Norrköping, Sweden
Project cooperation
Veneta Ivanova
Business Development Sensor Systems at Silicon Austria Labs GmbH
Villach, Austria