Updated on 22 September 2026
PIC Fabrication and Advanced Photonic Assembly for Scalable Quantum Hardware
Founder at Qedė
About
Partner Profiles Sought
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TFLN PIC Foundries / Fabricators: Capabilities in custom Photonic Integrated Circuit (PIC) fabrication on Thin-Film Lithium Niobate substrates, incorporating low-loss ridge waveguides and high-extinction electro-optic components.
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Photonic Assembly & Packaging Specialists: Expertise in high-density optical fiber array coupling, high-NA grating coupler interfacing, precise multi-chip packaging, and thermal/mechanical stabilization.
Funding & Collaboration Framework
We offer flexible partnership models tailored to shared commercial and technical goals, including:
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Public / EU Co-Funding: Consortium building for upcoming European or national grant calls (e.g., Horizon Europe, Chips JU, EIC, national quantum initiatives).
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Private / Venture-Backed Pipeline: Direct commercial development, joint venture, or supplier-partner contracts funded through private investment.
Similar opportunities
Product
Electro-optical wafer-probing in production of PICs and silicon photonics
- Buyer
- Manufacturer
- Re-Seller/Wholesaler
- Demonstration / Pilot projects
Jan Suske
Sales and Product Manager at Nanofaktur GmbH
Expertise
Phase-change materials for tunable photonics
Filip Ligmajer
Assistant Professor at Brno University of Technology