Baltic Photonics 2026 MATCHMAKING

25 Sept 2026 | Vilnius, Lithuania

Project cooperationUpdated on 22 September 2026

PIC Fabrication and Advanced Photonic Assembly for Scalable Quantum Hardware

Founder at Qedė

About

Partner Profiles Sought

  • TFLN PIC Foundries / Fabricators: Capabilities in custom Photonic Integrated Circuit (PIC) fabrication on Thin-Film Lithium Niobate substrates, incorporating low-loss ridge waveguides and high-extinction electro-optic components.

  • Photonic Assembly & Packaging Specialists: Expertise in high-density optical fiber array coupling, high-NA grating coupler interfacing, precise multi-chip packaging, and thermal/mechanical stabilization.

Funding & Collaboration Framework

We offer flexible partnership models tailored to shared commercial and technical goals, including:

  • Public / EU Co-Funding: Consortium building for upcoming European or national grant calls (e.g., Horizon Europe, Chips JU, EIC, national quantum initiatives).

  • Private / Venture-Backed Pipeline: Direct commercial development, joint venture, or supplier-partner contracts funded through private investment.

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