Thermal Analysis, Simulation & Cooling Design for High-Power Electronics and Photonic Modules

We provide thermal analysis, simulation and thermal management services for complex high-power electronic devices, photonic and optoelectronic modules.

Our work can cover the complete thermal engineering process: from evaluation of the initial design and definition of thermal requirements to detailed simulation, identification of hotspots and development or optimization of the cooling concept.

Using advanced CFD and multiphysics simulation tools, we analyze heat transfer, temperature distribution and airflow in PCBs, electronic assemblies, enclosures and complete systems. Different cooling concepts, materials, heat sinks, fans and other design alternatives can be evaluated virtually before building physical prototypes.

For photonic and optoelectronic applications, where temperature stability can directly affect performance and reliability, thermal analysis can help identify critical thermal interactions and ensure effective heat removal from high-power and temperature-sensitive components.

The service can be applied at different stages of product development, from early design studies to verification and optimization of an existing product, helping reduce thermal risks, shorten development cycles and minimize the need for costly prototype iterations.