Active Thermal Components

Active thermal solutions are essential where passive methods cannot keep pace with the extreme heat loads of modern spacecraft, aerospace platforms, and defence systems. Boyd’s portfolio includes Liquid Cold Plates and Pump-Assisted Cooling Loops, providing scalable solutions from component-level cooling to full-system heat rejection.

• Liquid Cold Plates – Custom brazed/machined designs for high-power electronics, avionics, and payload equipment. Engineered from brazed or machined metal plates with integrated coolant channels.

  Provide direct, high-efficiency cooling to high-power electronics, avionics, radar modules, and payload equipment.

  Can be custom-shaped to integrate into structures, offering both thermal and mechanical support.

  Applications:
  • Space: On-board processors, payload amplifiers, satellite power distribution units, battery modules.
  • Aerospace: High-power radar systems in aircraft, electronic warfare pods, avionics in UAVs.
  • Defence: Ground vehicle power electronics, ruggedized computing, directed-energy weapon power conditioning units..

• Pump-Assisted Cooling Loops – For high-density spacecraft electronics where heat rejection requires circulation. Closed-loop liquid cooling systems that actively circulate coolant through multiple cold plates and radiators.

  Enable multi-kilowatt thermal control across distributed systems, where passive loops or conduction methods saturate.

  Offer adjustable flow rates for precise temperature regulation, and redundancy options for mission-critical reliability.
  Applications:
  • Space: Telecom satellites with massive onboard processing loads, high-resolution imaging payloads, crewed spacecraft environmental control systems.
  • Aerospace: Next-gen fighter avionics bays, airborne radar with continuous high-duty cycles.
  • Defence: Cooling high-energy lasers, advanced radar systems, and electronic warfare suites on naval vessels or armored vehicles.

Combined Value

• Liquid Cold Plates handle local, component-level cooling with precision and structural integration.

• Pump-Assisted Loops extend this to platform-level cooling, managing entire subsystems or payload suites.

• Together, they form a comprehensive active thermal management infrastructure for demanding aerospace, space, and defence missions.