Rugged Computing

Some environments destroy conventional electronics: thermal shocks ranging from -40°C to 70°C, continuous vibration, salt, humidity, and fungus. ADLINK’s rugged solutions are specifically designed to withstand these conditions, backed by over 30 years of embedded expertise and certifications including EN 50155, EN 45545-2, and IEC 62443-4-1.

Extreme resilience, built-in. Each board features high-Tg PCBs with FloTHERM thermal validation, soldered components that eliminate connector failures caused by vibration, and conformal coating with UV tracers for protection against salt, humidity, and fungus. This is not an afterthought; it is integral to the design from day one.

Open architecture, optimized weight. Standards such as VNX+ (VITA 90), OSM, and SMARC minimize size and weight without compromising performance, offering both low-power Arm and x86 solutions, as well as SOSA-aligned platforms for critical open-system programs.

Guaranteed continuity. A product lifecycle of over 10 years—aligned with rail and aerospace project cycles—backed by Tier-1 silicon partners such as Intel, NVIDIA, AMD, and Arm.

Edge AI-ready. Features include MXM 3.1 Type A/B slots for field-upgradable GPU acceleration, pre-validated AI platforms developed with NVIDIA and Intel, and robust support for real-time object detection, radar processing, and sensor fusion.

Additionally, ADLINK offers comprehensive ODM services—including proprietary CPU/GPU design, carrier board integration, and certification to rigorous standards (MIL-STD-810G, EN 50155, IEC 62443-4-1)—supporting the project from initial design through to production and after-sales service. It is the same philosophy we apply at QNV: not selling from a catalog, but rather adapting the technology to the project.