Expertise
Optical interconnects for photonic integration/packaging
We leverage 3D-fabrication of optical interconnects (chip-to-chip, fiber-to-chip, beam shaping) for photonic integrated circuits.
Author
Co-founder, CEO
LightSpring Photonics
Besançon, France
Lightspring solves photonic integration through 3D lithography. Our solutions include high performance optical coupling / interconnects and 3D passive circuits.
Engineer, entrepreneur (1 exit), launching a new spinoff to 3D solve photonic integration.
Expertise
Optical interconnects for photonic integration/packaging
We leverage 3D-fabrication of optical interconnects (chip-to-chip, fiber-to-chip, beam shaping) for photonic integrated circuits.