Vikas Dubey

Senior Scientist

Fraunhofer ENAS

Chemnitz, Saxony, Germany

10 profile visitsGerman Participant

I am a senior scientist at Fraunhofer ENAS. My research interest lies in 3D Heterogenous Integration. I am open to collaborate on IGSTC2+2 Call.

My organisation

Fraunhofer ENAS

Fraunhofer ENAS

R&D Institutions

Chemnitz, Germany

The Fraunhofer Institute for Electronic Nano Systems ENAS is the expert and development partner in the field of Smart Systems and their integration for a wide range of applications. We offer innovative solutions and support customer projects along the entire value chain of intelligent systems. From the idea to the design, technology development or implementation based on existing technologies, to the tested prototype and technology transfer, Fraunhofer ENAS is a reliable innovation partner for start-ups, SMEs, or large companies. In addition to technology development and Smart Sensor Systems, the institute focuses on the development of application demonstrators as part of upstream product development. We develop high-precision sensors, new sensor and actuator systems based on integrated nanostructures and standard technologies, beyond CMOS devices, innovative integration technologies, advanced reliability concepts, and complement them with innovative approaches in the areas of simulation, data analysis with artificial intelligence, or system security. Through requirement engineering, we adapt the systems for different applications and embed them in more complex overarching systems. To focus our activities, Fraunhofer ENAS places emphasis on the three business units that are set up along the value chain of Smart Systems: Process, Device and Packaging Technologies, Smart Systems, Test and Reliability Solutions
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About me

15 years of experience in Semiconductor Process Integration. Authored 25+ publications and 4 patents in the field of semiconductor assembly and packaging. Collaborated with international teams and contributed to various multidisciplinary partner-oriented projects to enable next-generation assembly and packaging challenges.

Social media

Skills

  • project management
  • Wafer bonding
  • Metrology
  • AFM
  • python
  • MS Office
  • D2W Bonding
  • Eutectic Bonding
  • 3D Heterogenous Integration
  • Advance Packaging

Interests

  • Power Electronics
  • Quantum Computing
  • MEMS
  • 3D Heterogenous Integration
  • computing
  • memory

Marketplace (1)

  • Project cooperation

    2025_IGSTC 2+2 Call

    IGSTC intends to catalyze innovation centric R&D&I projects by synergising the strength of research/academic institution.

    • Early
    • Research
    • Technical
    • commercialization
    • Technology/product development
    • Sensor Materials and Technologies
    Author

    Vikas Dubey

    Senior Scientist at Fraunhofer ENAS

    Chemnitz, Saxony, Germany