ExpertiseUpdated on 26 January 2026
Swiss high-reliability microelectronics assembly and advanced packaging: COB, wire bonding, flip chip, from TRL to series.
CEO at Hybrid SA
Chez-le-Bart, Switzerland
About
Hybrid SA is a Swiss subcontractor specializing in high-reliability microelectronics assembly and advanced packaging. We deliver precision processes such as chip-on-board, wire bonding, flip chip and solder flip chip, supporting products from industrialization to serial production for space, medical, sensors and other demanding industries.
Similar opportunities
Project cooperation
Development of Recyclable Power Electronics Modules
Roger Wise
Founder & CEO at Ultrawise Innovation Limited
Bishop's Stortford, United Kingdom
Product
- Buyer
- License partner
- Demonstration / Pilot projects
Abdelrahman Shalaby
Founder & CEO at Ashtronix
Swindon, United Kingdom
Partnership
- Research
- Joint development
- Knowledge transfer
Grant Gwyther
Commercial & Partnerships Lead at Touchlab Limited
Riccarton, United Kingdom