Opportunities for UK-Swiss Semiconductor Collaboration

26 – 30 Jan 2026 | Switzerland

ExpertiseUpdated on 26 January 2026

Swiss high-reliability microelectronics assembly and advanced packaging: COB, wire bonding, flip chip, from TRL to series.

CEO at Hybrid SA

Chez-le-Bart, Switzerland

About

Hybrid SA is a Swiss subcontractor specializing in high-reliability microelectronics assembly and advanced packaging. We deliver precision processes such as chip-on-board, wire bonding, flip chip and solder flip chip, supporting products from industrialization to serial production for space, medical, sensors and other demanding industries.

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