Seeking Japanese Semiconductor Partner for Conductive and ESD Packaging Collaboration

Gain a cost advantage and future-proof your exports to the EU with Intace’s biodegradable conductive and ESD-safe foam. Our drop-in replacement for petroleum-based foams offers the same performance at lower cost while meeting upcoming EU sustainability and plastic regulations. Partner with us to pilot and validate this next-generation semiconductor packaging solution.

Intace is developing biodegradable, antistatic, and conductive foam that can serve as a drop-in replacement for petroleum-based foams currently used in electronic and semiconductor packaging.

We are looking for a partner in the semiconductor industry who can act as a strategic or pilot partner to help test our product and evaluate its performance. Specifically, we want to assess compatibility with their products and supply chain, gather feedback on performance and pricing expectations, and explore opportunities for further collaboration.

For our potential Japanese partners, Intace offers a unique opportunity to lead in sustainable innovation without increasing cost or complexity. Our biodegradable foam is designed to be a first ever drop-in replacement for conventional plastic antistatic and conductive foams, offering the same or even lower cost compared to the materials currently used.

Unlike most sustainable alternatives that are significantly more expensive, our solution delivers cost parity while helping companies avoid upcoming plastic taxes and regulatory pressures, particularly those that will take effect in the EU by 2030. This means our partners can continue to export to the UK and EU markets smoothly, without disruption or compliance risks.

Beyond compliance, adopting Intace’s technology provides a brand advantage. It demonstrates environmental leadership and aligns with global customers’ growing preference for low-impact and circular materials. Partnering with us allows companies to strengthen their sustainability credentials, enhance their market reputation, and position themselves at the forefront of next-generation packaging solutions.

The ideal outcome is to validate our product's performance against industry standards and potentially secure a collaborative agreement.