QS200/QS300

Overview:
The QS 200 and QS 300 are semi-automated coater/developer tools designed for R&D and pilot-manufacturing applications. They provide a cost-effective solution for resist processing (coating + developing + thermal) with high configurability.

Key Features:

• The QS 200 supports substrates from 2″ up to 8″ Ø (or 2″×2″ to 6″×6″ square); the QS 300 supports from 2″ up to 12″ Ø (or 2″×2″ to 9″×9″ square) for greater flexibility.

• Process modules (coating, developing, thermal) share the same platform technology as Obducat’s high-volume manufacturing (HVM) tools—this enables easier scale-up from pilot to production.

• High configurability: options include advanced features like the RCCT™ (Rotating Covered Chuck Technology) for improved coating uniformity, edge-bead removal (EBR), temperature-controlled dispense lines and developer modules with both puddle and spray capabilities.

• Designed with R&D/pilot constraints in mind: high reliability, low cost-of-ownership and flexible setup (bench-mounted modules or standalone units) make it suited for evolving manufacturing environments.

Applications:

• Suitable for advanced applications such as LEDs and displays, SiC components, 5G modules, MEMS, opto-electronic/photonic devices and advanced packaging.

• Ideal as a bridge between lab-scale processes and volume manufacturing thanks to its shared module architecture with production tools.