APECS – Advanced Packaging and Heterogeneous Integration for Europe’s Next Generation Semiconductor Technologies

APECS (Advanced Packaging and Heterogeneous Integration for Electronic Components and Systems) is the European pilot line that provides Europe with innovation capabilities in advanced packaging and heterogeneous integration of systems based on chiplets, QMI, RF, opto, sensor as well as passive components. 

As one of five pilot lines established under the European Chips Act, APECS enables access to critical services, skills and training for European companies, especially SMEs, to integrate and package chiplets into novel electronic components and systems. By bringing together diverse technologies, fostering multi-level collaboration, and providing seamless access to cutting-edge solutions, APECS contributes to building a resilient and thriving microelectronics ecosystem that enables European companies, from Startups through SMEs to industry leaders, to play a key role in the global semiconductor market. 

APECS plays a vital role in enhancing Europe's strategic autonomy by reducing dependence on foreign suppliers and strengthening Europe's capabilities in critical technology areas. This is essential for the resilience and competitive advantage in areas such as telecommunications, high-performance computing (HPC), Artificial Intelligence/Machine Learning (AI/ML), sensor systems, medical and scientific instrumentation as well as industrial manufacturing in Europe.  

The APECS consortium brings together the technological competences, infrastructure, and know-how of ten partners from eight European countries: Germany (Fraunhofer-Gesellschaft as coordinator, FBH, IHP), France (CEA-Leti), Belgium (imec), Finland (VTT), Austria (TU Graz), Greece (FORTH), Spain (IMB-CNM, CSIC) and Portugal (INL). 

APECS is coordinated by the Fraunhofer-Gesellschaft and implemented by the Research Fab Microelectronics Germany (FMD). APECS is co-funded by the Chips Joint Undertaking and national funding authorities of Austria, Belgium, Finland, France, Germany, Greece, Portugal, Spain, through the Chips for Europe Initiative.