Project
Malaysia Semiconductor Advanced Packaging Technology Hub
Malaysia's Semiconductor Advanced Packaging Hub (APIRC + A/T factory) aims for global leadership in Fan-Out, 2.5D/3D packaging. It offers outsourced R&D/production, lowering barriers and attracting investment, aligning with national growth strategy.
- Yes
- None
- Equity
- Manufacturing
- Joint Venture
- R&D Cooperation
- Project Planning
- Financial Services
- Open for Negotiation
- Open for negotiation
- 50,000,001 USD or above
- Institutional Investment
- 25,000,001 to 50,000,000 USD
- Private Equity & Venture Capital
- Public-Private Partnership Project