Silicon Connect aspire to be Malaysia’s leading provider of outsourced advanced packaging solutions for the semiconductor industry. Focused on innovative technologies like Fan-Out,2.5D and 3D Packaging, the company offers R&D, prototyping, and high-volume manufacturing services through its state-of-the-art facilities. Committed to fostering industry collaboration and talent development, Silicon Connect aims to accelerate technology adoption, reduce entry barriers, and position Malaysia as a regional hub for semiconductor packaging. Leveraging strategic partnerships with global research institutes and industry leaders, the company drives innovation and growth in the rapidly expanding semiconductor market.
Malaysia's Semiconductor Advanced Packaging Hub (APIRC + A/T factory) aims for global leadership in Fan-Out, 2.5D/3D packaging. It offers outsourced R&D/production, lowering barriers and attracting investment, aligning with national growth strategy.