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ACT-Semiconductor Investor Partnership Networking Hub

1 Sept – 14 Oct 2026 | United Kingdom

InvestmentUpdated on 7 September 2026

National Manufacturing Institute Scotland - High Value Manufacturing Centre

Digital Infrastructure Lead - Connectivity at National Manufacturing Institute Scotland

Glasgow, United Kingdom

About

The National Manufacturing Institute Scotland (NMIS) has rapidly expanded its footprint into advanced connectivity and next-generation microelectronics by spearheading the establishment of Europe’s first open-access hub for advanced microchip integration. Driven by a strategic alliance between the University of Strathclyde, Innovate UK, and the Glasgow City Region Innovation Zone (GCRIZ), NMIS’s capabilities bridge the crucial gap between semiconductor wafer fabrication and systemic application deployment.

The ANZIC Ecosystem

Hosted within the University of Strathclyde's Advanced Net Zero Innovation Centre (ANZIC) in Renfrewshire, this ecosystem aligns advanced semiconductor and digital manufacturing with future clean industries. ANZIC facilitates:

  • Cross-Sector Innovation: Enabling advancements in power electronics, artificial intelligence (AI), photonics, radio frequency (RF), and quantum technologies.

  • Supply Chain De-risking: Providing a UK-owned domestic alternative to offshore advanced packaging, significantly reducing geopolitical risks and lead times.

NASPIC Core Capabilities

The National Advanced Semiconductor Packaging and Integration Centre (NASPIC) is the operational engine for microelectronics scale-up within NMIS. Supported by multi-million-pound funding injections, NASPIC delivers highly specialized lab-to-scale infrastructure:

  • Dramatic Lead-Time Reduction: Operates a dedicated 600 m² scale-up packaging line capable of slashing post-prototype chip integration times from months down to a matter of days.

  • Advanced Packaging Integration: Offers specialized expertise in complex bonding—such as forming sintered bonds between multi-die components of varying heights, double-sided cooling packages, and integrating substrates to heat sinks.

  • Comprehensive R&D Complement: Fully integrates with foundational NMIS capabilities, including material testing/characterization, digital engineering, big data analytics, and automation/robotics.

Through the combined strengths of ANZIC and NASPIC, NMIS serves as a critical open-access asset for accelerating high-value connectivity solutions, photonics, and power electronic systems into commercial reality.

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