Matchmaking @ 18th Silicon Saxony Day

11 Jun 2024 | Dresden, Germany

ProductUpdated on 11 June 2024

LidroCUT - innovative laser dicing machines

Christian Keil

Director Business Development and Sales at Lidrotec GmbH

Bochum, Germany

About

We build laser dicing machines to cut wafer for the semiconductor industry, that enable thinner cuts with a 0% damage rate for every wafer. Our unique innovation is the use of liquids to cool and rinse the wafers while they are cut with the laser.
Users of our cutting-edge technology reduce their costs and increases their output.

Looking for

  • Distribution Partner
  • Project Partner
  • End user

Applies to

  • Microtechnology
  • Microelectronics system
  • Hardware

Organisation

Lidrotec GmbH

Small and medium enterprise

Bochum, Germany

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