Micro-channel heat exchangers for compact and efficient thermal management

TWI has developed a next-generation micro-channel heat exchanger (MCHX) in collaboration with the European Space Agency (ESA), demonstrating the potential of ultra-compact, high-density cooling structures for demanding thermal management applications such as reusable launch systems.

Within the ESA-funded project, TWI worked alongside partners (including Confluent Research Ltd) to develop and validate novel channel geometries, materials and designs with the objectives of maximizing heat transfer, maintaining laminar flow, minimising pressure losses and controlling vapour formation.
Computational fluid dynamics (CFD) and analytic modelling underpinned the design, aiming for performance metrics including a Nusselt number greater than 10 (Nu > 10) in cross-flow hydrogen–helium cycles relevant for space propulsion.

TWI’s role extended to manufacturing breadboard units using stacked shim photochemical etching and diffusion bonding techniques (e.g. printed-circuit heat exchanger (PCHE) style) delivering high strength, leak-tight assemblies compatible with extreme service conditions. Our capability spans design, simulation, fabrication, joining, and validation of dense micro-channel architectures.

Key features and benefits

• Ultra-dense channel architecture for enhanced heat transfer and compact footprint

• Lightweight, monolithic design with minimal internal joints or seals

• Validated for high-performance fluids (e.g. H₂/He) and high-pressure / high-temperature environments

• Customisable geometries for embedded cooling in structural or electronic components

• Compatible with space-grade materials: stainless steel (316L), aluminium, titanium, nickel alloys

• Demonstrated collaboration with ESA and other high-profile aerospace organisations (including Reaction Engines Ltd) strengthening credibility.

Applications

• Satellites and payload thermal control systems

• Compact radiators and cold plates for electric propulsion

• Cooling of high-power electronics and RF modules in orbital systems

• Cryogenic fluid management and two-phase flow systems

• High-temperature / high-pressure applications in both space and terrestrial sectors (e.g. geothermal, aero-propulsion)

Collaboration invitation
TWI is now seeking end-users, system integrators and thermal subsystem developers to further mature and tailor this micro-channel heat exchanger technology for mission-specific requirements. We provide a full pathway from concept through thermal modelling, manufacturing, testing and qualification of flight-ready systems. Our intention is to form partnerships that demonstrate performance, reliability and manufacturability in real operational environments, supporting the next generation of spacecraft and exploration missions.