Silicon Austria Labs

Power Electronics for Energy Transition Symposium

30 Sept – 1 Oct 2025 | Graz, Austria

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ISMAIL RECEPI

Scientist

Silicon Austria Labs

GRAZ, Austria

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Ismail Recepi, Scientist at Silicon Austria Labs (SAL), Graz; expertise in systems integration, thermal management, and reliability in power electronics systems

My organisation

Silicon Austria Labs

Silicon Austria Labs

Academia

Graz, Linz, Villach, Austria

Room for innovation with Silicon Austria Labs Silicon Austria Labs is a top research center for Electronics and Software Based Systems (ESBS), which are the technological backbone of digitization. At three locations (Graz, Villach, Linz), SAL is conducting research in the areas of Microsystems, Sensor Systems, Power Electronics, Intelligent Wireless Systems and Embedded Systems to develop future-oriented solutions for industrial production, health, energy, mobility and safety. SAL brings together key players from industry, science and research and thus valuable expertise and know-how and conducts cooperative, application-oriented research along the value chain. Cooperative projects are co-financed by SAL and enable a fast and unbureaucratic project start. SAL is thus shaping the high-tech locations Austria and Europe and "unfolds the future".
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About me

Ismail Recepi received the B.Sc. degree in Mechanical/Automotive Engineering from Hacettepe University, Ankara, Turkey, in 2018, and the M.Sc. degree in Systems Design from Carinthia University of Applied Sciences (FH Kärnten), Villach, Austria, in 2020. He is currently a Scientist at Silicon Austria Labs (SAL), Graz, Austria, within the Division of Power Electronics at the System Level Integration Technology unit. His expertise includes systems integration, thermal management, and mechanical reliability of power electronic systems. His research emphasizes advanced systems integration, thermal management techniques, mechanical reliability assessments, and innovative packaging technologies for power electronic systems. He has significantly contributed to projects involving simulation-driven designs, ECAD-MCAD collaboration, planar magnetics integration, and sophisticated cooling technologies.

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Skills

  • ECAD-MCAD collaboration
  • Thermal Simulations
  • Reduced Order Modelling (ROM)
  • Planar Magnetics Integration
  • Thermal Management
  • System-Level Integration
  • Finite Element Analysis (FEA)

Interests

  • Semiconductor Packaging
  • Advanced Cooling Technologies
  • Multi-Disciplinary Optimization
  • Thermal Management
  • Power Electronics

Speaker sessions (1)

Tuesday, 30 September 2025

17:40 - 18:30

Poster Session 2

Location:FoyerTrack:Poster
  • Power Electronics in automotive applications
  • Power Electronics in medium voltage applications
  • Charging
  • DC Industry
  • Sustainability & Circular Economy in Power Electronics

Poster session in the exhibition area (all topics) click for details