Assembly - High Precision

Hykor’s Medical‑Device Assembly Services

ISO 13485‑aligned quality system
While not always explicitly stated, Hykor operates within highly regulated high‑tech supply chains—such as semiconductor, laboratory, and medical—implying a firm commitment to quality standards aligned with ISO 13485 for medical device manufacturing.

High‑precision, small‑series mechatronic assembly
Hykor specializes in "fijnmechanica" (fine mechanics) and excels in small‑series assembly of complex mechatronic systems. Their engineers and assemblers are skilled at transforming intricate conceptual designs into precise, ready‑to‑use subsystems.

Integrated electromechanical and electronic assembly
They manage mechanical and electronic integration—PCB mounting, wire harnessing, control units, sensors—within multifunctional modules for diagnostic, measurement, or life‑science equipment.

Special gluing and bonding processes
In-house capabilities support special adhesive bonding and curing processes—critical for sealing small medical components—ensuring strong, durable joints with full traceability.

Controlled environment and traceability
Operating like a “flexibele schakels” (flexible link) in high‑tech supply chains, Hykor emphasizes rigorous quality control, product verification, thorough testing, and precise documentation at every step.

Turnkey support: from engineering to final testing
They offer a full-service approach: engineering consultation, fixture design, assembly line setup, testing protocols, pilot series, and small‑batch production—all delivered efficiently and rapidly.

🔧 Machining Capabilities to Complement Assembly

Explore Hykor’s machining capabilities—which form the foundation of their precision assembly services—through their machining page:

Hykor Machining Capabilities

CNC milling, turning, grinding, and drilling

• Capacity for five‑axis and other advanced machining for tight tolerances

• Custom tooling and fixturing design

• Support for bio‑compatible materials, electronics-enclosure parts, sensor modules, and mechanical subassemblies