Optical interconnects for photonic integration/packaging

We leverage a 3D lithography process (Two-Photon Polymerization) technique with unique process recipes, design software and component designs. We allow fast, on-chip fabrication of optical interconnects to solve a variety of photonic packaging problems. We have achieved a high control of optical confinement (single and multimode), low losses and a high freedom in topology to account for various types of interconnects: free-space, laser to chip, fiber(s)-to-chip, and direct integration of 3D passive functions to a chip.

The process can scale to wafer-level packaging with high throughputs.

We are seeking partners / customers to apply that expertise on impactful use cases.