ProductUpdated on 14 January 2026

Embedded Die Packaging, Power Modules and more

Managing Director and Co-Owner at RAM Innovations Ltd

Pentre, United Kingdom

About

RAM's technology embeds semiconductor dies directly into printed circuit boards, reducing parasitics and enabling compact, lightweight, and highly efficient power modules demanded by automotive, aerospace, industrial and energy markets. This approach directly addresses electrification challenges by delivering higher efficiency, smaller footprint and lower system cost

We are looking for precision placement technology (R&D) developement, copper sintering, high temperature laminates, isolation with heatsinking.

RAM Innovations

Looking for

  • Buyer
  • License partner
  • Demonstration / Pilot projects

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