ProductUpdated on 14 January 2026
Embedded Die Packaging, Power Modules and more
Managing Director and Co-Owner at RAM Innovations Ltd
Pentre, United Kingdom
About
RAM's technology embeds semiconductor dies directly into printed circuit boards, reducing parasitics and enabling compact, lightweight, and highly efficient power modules demanded by automotive, aerospace, industrial and energy markets. This approach directly addresses electrification challenges by delivering higher efficiency, smaller footprint and lower system cost
We are looking for precision placement technology (R&D) developement, copper sintering, high temperature laminates, isolation with heatsinking.
Looking for
- Buyer
- License partner
- Demonstration / Pilot projects
Similar opportunities
Product
- Buyer
- License partner
- Demonstration / Pilot projects
Abdelrahman Shalaby
Founder & CEO at Ashtronix
Swindon, United Kingdom
Expertise
Power electronics design and recycling expertise
Roger Wise
Founder & CEO at Ultrawise Innovation Limited
Bishop's Stortford, United Kingdom
Product
Seals for the SEMICON industry
- Manufacturer
Guido Brüggemann
Senior Engineer and Expert in Seals for SEMICON at Freudenberg Sealing Technologies
Zurich, Switzerland