ExpertiseUpdated on 12 August 2025
Advanced Packaging and system integration
Strategy & Business development at Fraunhofer IZM
Berlin, Germany
About
Fraunhofer IZM focuses its activities on advanced Packaging, from technology processes to system design, characterizations and reliability. Miniaturization, form factor, functionality optimization, low power system are the main challenges for the integration for Co-packaged optics (mainly for data center communications), medical sensors, radar, 6G and space applications.
Similar opportunities
Expertise
Highly reliable and efficient power converters for low- and medium- voltage energy systems
Yoann Pascal
Researcher - Group leader at Fraunhofer ISIT - EES
Kiel, Germany
Expertise
MEMS, Microsystems characterization
- Electronics
- Mechanical engineering
- Mechatronics & Robotics
- Equipment, Technologies, Instruments
Florent DEUX
Directeur Général at Polytec
Châtillon, France
Expertise
- Smart Cities
- New Materials
- Infrastructure
- Oil, Gas & Mining
- Meteorology & Climate
- Marine Engineering & Offshore Operations
- Building, Construction & Civil Engineering
Julia Rosin
Group Leader Research at Fraunhofer-Insitute for High-Speed Dynamics, Ernst-Mach-Institut, EMI
Freiburg, Germany