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ExpertiseUpdated on 12 August 2025

Advanced Packaging and system integration

Strategy & Business development at Fraunhofer IZM

Berlin, Germany

About

Fraunhofer IZM focuses its activities on advanced Packaging, from technology processes to system design, characterizations and reliability. Miniaturization, form factor, functionality optimization, low power system are the main challenges for the integration for Co-packaged optics (mainly for data center communications), medical sensors, radar, 6G and space applications.

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