TherMap Solutions

TherMap Solutions, a University of Bristol spin-out, designs advanced laser-based thermal characterization instruments for accurate measurement of critical thermal properties in complex semiconductor structures. Its technology enables in-situ analysis of layers like die attach and adapts for high-throughput defect detection in wafer bonding and vias, accelerating thermal design and ensuring reliability. TherMap Solutions aim to establish R&D collaborations with key players in power electronics and advanced packaging and connect with prospective metrology partners, end customers and funders in one of the largest potential markets.