Sustainable and greener electronic components and systems manufacturing

The manufacturing phase is responsible for the largest share of carbon footprint and environmental impact within the life cycle of most electronic products. Hence, it is compulsory to provide incentives for developing the means toward a better use of the resources during the Electronics components and systems (ECS) manufacturing and the reduction of the future ecological footprint of the EU chipmakers to cope with the Green Deal objectives. Moreover, to avoid wasting of critical mineral resources, it becomes urgent to look for processes that are more eco-friendly in the use of these materials, and still remining economical. This session will focus on the R&D actions needed to decrease the environmental footprint of ECS and at the same time minimizing the European strategic dependency on critical resources.

Session chairman : Prof. Jean-Pierre Raskin (UCLouvain)

• Prof. David Bol. Associate professor at UCLouvain (BE). Leads the ECS group focused on ultra-low-power IC design for environmental and biomedical IoT applications.

• Patrick Blouet. R&D program manager at STMicroelectronics

• Hugues Ferreboeuf. Project manager, the Shift project

• Dr Marie Garcia-Bardon. Senior Scientist at IMEC

• Dr. Yves Gigase. Head of programme at CHIPS JU