Looking for partners HORIZON-CL5-2027-05-D4-06

HORIZON-CL5-2027-05-D4-06: Thermal energy optimisation and waste heat recovery of high energy demand IT rooms in buildings or small edge data centres.

We offer solutions that substantially improve heat removal from high-power AI chips (e.g. direct on-chip cooling, advanced thermal interface materials, multi-scale thermal management), enabling higher performance without thermal throttling. This should lead to lower cooling energy needs and higher reliability for dense AI workloads.

**We are especially interested in building synergies with Energy efficiency and sustainability of AI data processing in Data Centres (IA)**HORIZON-CL4-2027-04-DATA-09.

Direct on-chip cooling and thermal management, including novel and innovative cooling techniques applied at chip and module level (direct liquid cooling, heat spreaders, thermal interface materials, and advanced packaging) and multi-scale thermal management techniques.